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Missed the 7th International ACC Conference in 2025?
You can still access one of our most in-demand sessions. Unlock the on-demand recording of this high-level panel discussion:
Chiplet Market & Future Challenges – Insights from Samsung, imec, Synopsys, and Cadence
Moderated by Bernhard Rill
Leading experts from across the global semiconductor ecosystem share their views on the future of chiplet architectures, the hurdles to wider adoption, and the innovations shaping next-generation multi-die systems.
Featuring:
• Ricardo Gomez Gomez, Senior Technical Marketing Manager, Samsung Semiconductor Europe GmbH
• Bart Placklé, Vice President Automotive, Imec
• Tanuja Rao, Executive Director, Multi-Die Solutions Architect, Synopsys
• Dr. Ericles Sousa, Co-Chair / SoC Architect, UCIe Consortium Automotive WG / Cadence Design Systems
What you will learn:
– Market forces accelerating chiplet adoption
– Technical + economic challenges in the transition to multi-die systems
– Automotive requirements and cross-industry collaboration
– The role of UCIe in enabling scalable, interoperable chiplet integration
– Expert insights on design, packaging, standardization, and future architectures
If you work in semiconductors, chip design, automotive electronics, packaging, or system architecture, this session is essential viewing.
Enter your contact details below to access the recording and stay updated on future insights into chip technologies, innovation, and industry trends.